The fellows are expected to spend six months in the U.S., and six months in Singapore. This year, there are four awards available, each of those covers stipend, tuition, and international travel support. For an overview of what is detailed in this article, kindly click on the table of content.
Fellowship Description
The Singapore-Stanford Biodesign (SSB) Fellowship seeks to train and nurture the next generation of Asian medical device innovators in Singapore, serving Asia and beyond. This highly competitive fellowship is directed towards creative and entrepreneurial Singapore citizens or Permanent Residents, who have a strong interest in invention and early-stage development of new medical technologies.
Award Value
Each of the winners of this scholarship will receive benefits of stipend, tuition, and international travel support.
Level and Area of Studies
Singapore-Stanford Biodesign Fellowship 2022 is open to students pursuing a non-degree program in Biodesign fields.
Place of Study
The Singapore-Stanford Biodesign Fellowship 2022 program can be taken in the U.S and Singapore.
Eligibility and Criteria
This fellowship is offered to individuals with a strong interest in Asian medical device innovation. Successful applicants should have advanced degrees (e.g. Master, Ph.D., M.D., M.B.B.S.) and/or significant industry work experience. Candidates will be judged in terms of their potential to become leaders in biomedical technology innovation, including demonstrated potential in creativity and invention.
Applicants’ Nationality
Priority will be given to Singapore citizens or Permanent Residents of the country.
Application Instruction
To apply, you must fill out the application form at the website link below.
Submission Deadline
2 May each year. Website and Application Link Does this article meet your immediate needs? If yes, leave us with a 5-star rating in the Review Box below. However, if no, leave a comment on the comment box to express your concern or ask the question and we will get back to you as soon as possible.